Events in China and Hong Kong

Semiconductor-focused exhibition covering IC design, fabrication, packaging and testing, compound semiconductors, equipment and materials.

Professional electronics and embedded-systems expo covering chips, memory, edge AI, power semiconductors, automotive electronics and components.

High-level optics and photonics conference co-located with CIOE, covering optical materials, precision testing, thin films, lasers, infrared and optoelectronic devices, photonic integration, lithography-related technologies, quantum optics, sensing and advanced laser manufacturing.

AI computing infrastructure exhibition covering servers, storage, AI chips, memory, supercomputing centres, intelligent computing centres and edge data centres.

Data-center energy-efficiency exhibition covering power systems, cooling, energy management, monitoring, high-efficiency infrastructure and green data-center technologies.

Data-center liquid cooling exhibition covering cooling materials, equipment, piping, connectors and core technologies for high-density computing infrastructure.

Green data-center exhibition covering high-efficiency power systems, cooling, energy management, renewable integration, monitoring and low-carbon infrastructure.

Technology-transfer and industry–research cooperation conference focused on AI, biomedicine, integrated circuits, new energy, advanced materials, low-altitude economy and aerospace technologies.